JOB DESCRIPTION :
1.System Integration, testing and
maintenance at customer location
2.Co-ordinate with thermal analysis
engineer to realize desired thermal performance
3.Meet customers for requirement
capture and update/status review.
4.Responsible for design and
deliver of high speed board (FPGA and CPU based) to successful closure
5.Technical management of complete
project cycle – Architecture, documentation, design, Fabrication, testing and
delivery.
6.Co-ordinate with cross functional
teams like PCB team, SI analysis,
Mechanical to deliver the work and track schedule
7.Qualifying system at different
qualified test facility
Educational Qualification : B.E /
M.E/M.Tech
Experience : experienced
Location : Bengaluru
No of Positions: 5
KEY SKILL SET :
1.Complex Hardware Design using
FPGA, Power PC and Mixed signal devices ( Analog & Digital)
2.System architecture including
partitioning of hardware/software/FPGA tradeoffs
3.High speed board design
techniques : Signal Integrity (SI) and Timing Analysis and Thermal Analysis
4.Design of Hybrid systems with
Digital, RF and COTs boards
5.Thermal management at board and
system level using different types of cooling such as air, liquid and forced
air.
6.System qualification for MIL
standards (Environmental and EMI/EMC)
7.Schematic and PCB design tools
like OrCad and Allegro tool
8.Designing with high speed
Interface protocols like PCIe, SRIO, Giga bit Ethernet, 10G Rocket IO
9.Board bring-up, testing and
troubleshooting/debugging
10.Test automation using test
equipment like Logic Analyzer, Digital Storage Oscilloscope, RF Signal
Generator, Spectrum Analyzer, Network Analyzer
you can send your resume to
careers@coreel.com. If you are a fresher, kindly send your resume to
freshers@coreel.com.
For more details :
http://www.coreel.com/careers/current-openings/
